The service life of 3D TLC flash memory is approaching SLC / MLC

Memory modules for industry
The service life of 3D TLC flash memory is approaching SLC / MLC

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BRESSNER Technology together with the manufacturer ATP Electronics introduces new M.2 NVMe, M.2 SATA and 2.5-inch 3D TLC flash memories to the market, which can compete with SLC and MLC memory modules.

M.2 SATA / NVMe SSDs can be used in a wide operating temperature range from -40 ° C to 85 ° C.

(photo: BRESSNER Technology GmbH)

In the early days of NAND flash storage, triple-level flash (TLC) was generally considered the best suited for read-intensive workloads, with durability and reliability lagging behind single-level (SLC) and Multi-Level Cell (MLC) cells. By storing three bits per cell, TLC offered more capacity and thus lower cost per bit, but also had problems with reliability and shorter lifetime.

In industrial applications, SLC flash memory is typically used for its reliability, but since it only stores one bit per cell, it tends to have less capacity and is very expensive. MLC is a compromise that stores two bits per cell but is still more expensive than TLC.

Last year, BRESSNER Technology and its long-term partner ATP Electronics unveiled the A700Pi / E700Pi-SATA-SSD series, which are based on 3D TLC and configured as pseudo SLC (pSLC). These SSDs have configurable endurance and use advanced controller and firmware technologies to ensure the hardware meets and exceeds the endurance requirements of demanding applications.

Health increased 10 times

These embedded SSDs provide the perfect balance between SLC / MLC and TLC. By storing only one bit per cell instead of three bits, the TLC capacity is reduced but the overall lifetime is increased up to 10 times compared to the same TLC products.

This year, BRESSNER gets closer to SLC and MLC storage with the ruggedness of ATP Electronics’ new 3D-TLC NVMe and SATA SSDs. Built-in solid state drives (SSD) series N750Si and N650Si / Sc (NVMe) as well as A750Pi and A650Si / Sc (SATA) produced with the new chip package break records of endurance.

Compared to other 3D TLC disks, they offer 66% more endurance in native TLC (Triple Level Cell) mode and 50% more endurance in pSLC (Pseudo Single Level Cell) mode, which puts them on a par with disks based on MLC or SLC Lamp flashing.

Slim modules with higher efficiency and capacity

Industrial ATP M.2 Serial ATA (SATA) and NVMe Solid State modules are available in Types 2242 and 2280. These slim modules offer increased performance and capacity compared to 2.5 ”SATA SSDs while minimizing the overall module footprint.

M.2 SATA / NVMe SSDs, which are available in both double-sided and single-sided versions, are characterized by high storage density, and thanks to the wide operating temperature range from -40 ° C to 85 ° C they are able to withstand harsh temperatures withstand fluctuations which are common in industrial environments.

Select M.2 SATA SSDs feature a microcontroller (MCU) that provides enhanced PLP protection under various temperatures, power outages, and charge states, protecting your data and storage device, providing a higher level of ATP M integrity and reliability The 2 modules are suitable for network and thin storage systems, point of sale (POS) systems and industrial computing applications.

M.2 SATA / NVMe SSDs are available in both double-sided and single-sided versions.
M.2 SATA / NVMe SSDs are available in both double-sided and single-sided versions.

(photo: BRESSNER Technology GmbH)

Five questions about technology and availability

What makes the controller or firmware used better than standard solutions? ATP uses different versions of 3D-TLC memory technology that offer greater overall write performance at very little additional cost. Controllers used with LDPC error correction do something else to extend this endurance compared to conventional BCH support.

BRESSNER deals with the industrial market. What are the special devices and protective technologies? ATP offers a variety of customizations such as coating, sulfur protection, content preloading, individual redundant sharing, proprietary hardware-based power loss protection design, heat management solutions (e.g. special heatsinks for NVMe SSDs), labeling with customer serial numbers e.t.c.

Are there error correction techniques or maybe multiple such as on die ECC and sideband? Today’s ATP NVMe SSDs secure your data using low-density parity (LDPC) and end-to-end data protection between communicating components.

Are temperature sensors integrated in the modules? Both integrated circuits contain temperature sensors, and external sensors ensure work safety.

What about the availability of modules? ATP has also not been affected by the semiconductor shortage, but almost all affected products have been redesigned to ensure rapid availability. Overall, the availability of ATP products is much better than that of many competitors as ATP has its own production facility and produces itself from the wafer level.

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